Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancingthermal transfer. The material has a very low compression set enabling the pad to be reusedmany times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance.With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at lowpressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improvedrework. The metallized liner lower coefficient of friction also allows for easy assembly ofparts that must slide together, such as a card into a chassis.

Features and Benefits